Oscilloscope Days 2024

Date

April 17 – April 18 2024

9.30 am – 12.30 pm

Become an expert oscilloscope user!

Learn from application oriented presentations – based on day to day testing challenges

Are you an electronic engineer facing challenges while trying to achieve your testing goals?

Join us for a two-day event where experts from Rohde & Schwarz and our partners will provide the latest updates on fundamentals and test features using the neXt-generation Oscilloscope. Our online sessions will cover applications and details discussions in the area of power electronics, EMC, as well as Signal and Power Integrity.

Don’t miss the opportunity to interact with our experts during live Q&A sessions.

We can’t wait to meet you online!

Time (CET)	Title	Description	Presenter
09:30 – 9:45	Welcome & introduction		Rohde & Schwarz
09:45 – 10:15	Opening keynote	Application-Oriented Power Cycling of Wide Bandgap Power Semiconductor Devices.	Prof. Kallfass from University of Stuttgart
10:15 – 11:05	Part 1: Test and Setup design challenges Session a: Measurements of Currents and High voltages Session b: Loop compensation – Buck Converter Design and Measurements	More and more applications become electrified and automated. Thus power consumption and efficiency become more important than in the past to reduce overall power consumption to a real minimum. This results in the need to efficient testing and adding counter measures like filters in the design. In this presentation we will give an overview what to keep in mind when designing your test bench and DUT especially for testing faster switching semiconductors made of SiC and GaN.	Nicholas Le Bas from Rohde & Schwarz Robert Schillinger & Mohamed Al-Alami from Würth Elektronik
11:05 – 11:15	Question & Answer
11:05 – 11:30	Break
11:30 – 12:20	Part 2: How to ensure EMC Session a: Spectrum analysis using oscilloscopes Session b: Design for EMC – Boost converster Design and Measurements	With an increasing integration density the interaction between different building blocks of any electrical system becomes a more crucial task to be investigated. This presentation will give you an overview on how to select and verify appropriate filter components as well as how to efficiently hunt down root causes of intra- and inter-system EMC at your bench.	Sofia Perez-Simbor from Rohde & Schwarz Robert Schillinger & Mohamed Al-Alami from Würth Elektronik
12:20 – 12:30	Question & Answer
12:30	Wrap-up		Rohde & Schwarz

Time (CET)

Title

Description

Presenter

09:30 – 9:45

Welcome & introduction

Rohde & Schwarz

09:45 – 10:15

Opening keynote

Application-Oriented Power Cycling of Wide Bandgap Power Semiconductor Devices.

Prof. Kallfass from University of Stuttgart

10:15 – 11:05

Part 1: Test and Setup design challenges

Session a: Measurements of Currents and High voltages
Session b: Loop compensation – Buck Converter Design and Measurements

More and more applications become electrified and automated. Thus power consumption and efficiency become more important than in the past to reduce overall power consumption to a real minimum. This results in the need to efficient testing and adding counter measures like filters in the design. In this presentation we will give an overview what to keep in mind when designing your test bench and DUT especially for testing faster switching semiconductors made of SiC and GaN.

Nicholas Le Bas from Rohde & Schwarz

Robert Schillinger & Mohamed Al-Alami from Würth Elektronik

11:05 – 11:15

Question & Answer

11:05 – 11:30

Break

11:30 – 12:20

Part 2: How to ensure EMC

Session a: Spectrum analysis using oscilloscopes
Session b: Design for EMC – Boost converster Design and Measurements

With an increasing integration density the interaction between different building blocks of any electrical system becomes a more crucial task to be investigated. This presentation will give you an overview on how to select and verify appropriate filter components as well as how to efficiently hunt down root causes of intra- and inter-system EMC at your bench.

Sofia Perez-Simbor from Rohde & Schwarz

Robert Schillinger & Mohamed Al-Alami from Würth Elektronik

12:20 – 12:30

Question & Answer

12:30

Wrap-up

Rohde & Schwarz

Time (CET)	Title	Description	Presenter
09:30 – 09:45	Welcome & introduction		Rohde & Schwarz
09:45 – 10:45	Part 3: Verification of System Parameters Session a: Test automation in Power electronics Session b: Measurement fundamentals on SMPS	When doing investigations on power converters besides the already well-known debugging as well as EMC topics also the need for in-situ characterization and qualification of components increased significantly. Thus this presentation will show you how Test automation in combination with enhanced analysis tools and selection of the right current and voltage probes will help to do this job more efficient and reliable.	Jens Schweickhardt from PE-Systems Alexander Küllmer from Rohde & Schwarz
10:45 – 11.00	Question and Answer
11:00 – 11:15	Break
11:15 – 12:15	Part 4: Signal Integrity debugging Session a: How to debug SI with PI? Session b: The Gigabit Ethernet Interface under EMC Aspects	Smart devices are becoming more and more popular and so there is a higher need to integrate several communication interfaces and CPU’s or SoC’s that are capable of handling and processing the large amount of data generated. Thus filtering on interconnects like e.g. Ethernet and also Signal Integrity debugging on interfaces like PCIe, USB become more and more important. In this presentation an overview on the interaction of Power and Signal Integrity as well as the interaction of filtering on data lanes will be given.	Pasi Suhonen from Rohde & Schwarz Adrian Stirn from Würth Elektronik
12:15 – 12:30	Question & Answer
12:30	Wrap-up		Rohde & Schwarz

Time (CET)

Title

Description

Presenter

09:30 – 09:45

Welcome & introduction

Rohde & Schwarz

09:45 – 10:45

Part 3: Verification of System Parameters

Session a: Test automation in Power electronics
Session b: Measurement fundamentals on SMPS

When doing investigations on power converters besides the already well-known debugging as well as EMC topics also the need for in-situ characterization and qualification of components increased significantly. Thus this presentation will show you how Test automation in combination with enhanced analysis tools and selection of the right current and voltage probes will help to do this job more efficient and reliable.

Jens Schweickhardt from PE-Systems

Alexander Küllmer from Rohde & Schwarz

10:45 – 11.00

Question and Answer

11:00 – 11:15

Break

11:15 – 12:15

Part 4: Signal Integrity debugging

Session a: How to debug SI with PI?
Session b: The Gigabit Ethernet Interface under EMC Aspects

Smart devices are becoming more and more popular and so there is a higher need to integrate several communication interfaces and CPU’s or SoC’s that are capable of handling and processing the large amount of data generated. Thus filtering on interconnects like e.g. Ethernet and also Signal Integrity debugging on interfaces like PCIe, USB become more and more important. In this presentation an overview on the interaction of Power and Signal Integrity as well as the interaction of filtering on data lanes will be given.

Pasi Suhonen from Rohde & Schwarz

Adrian Stirn from Würth Elektronik

12:15 – 12:30

Question & Answer

12:30

Wrap-up

Rohde & Schwarz