{"id":1428,"date":"2025-12-16T13:20:06","date_gmt":"2025-12-16T13:20:06","guid":{"rendered":"https:\/\/theemcnews.co.uk\/?post_type=job_listing&#038;p=1428"},"modified":"2026-01-16T00:09:24","modified_gmt":"2026-01-16T00:09:24","slug":"senior-principal-rf-manager","status":"expired","type":"job_listing","link":"https:\/\/theemcnews.co.uk\/?post_type=job_listing&p=1428","title":{"rendered":"Senior Principal RF Manager"},"content":{"rendered":"<div class=\"_18511feb _9f07686b ccd12878 _7741b210 e5f4fd56 _12990dd7 c95dbe20\">\n<h2 class=\"ff633f4c de7e746b _90bfa6b6 d395caa1 _2ec1d73a _94513f4f _06fe23e0 ca66e979 _8f40af10 _28c75f48\">About the job<\/h2>\n<\/div>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\">We\u2019re seeking a Senior Principal RF Manager to lead high-speed signal\/RF interface design and verification for next-generation optical network platforms. You\u2019ll own end-to-end RF architecture, compliance to OIF CEI specifications, simulation and modelling workflows (HFSS, S-parameter\/IBIS), and partner\/supplier technical engagement. This role blends hands-on technical leadership with strategic direction\u2014ideal for someone who drives decisions through rigorous design, system-level thinking, and <strong>iterative, agile development practices<\/strong>. You will also <strong>champion innovation across teams<\/strong>, introducing new methodologies, tools, and design approaches that elevate performance and accelerate time-to-market.<\/p>\n<p><strong>Key Responsibilities <\/strong><strong> RF Architecture, Design &amp; Verification <\/strong><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>Own the highspeed signal\/RF interface design and verification across product lifecycle (concept \u2192 bringup \u2192 validation) using ambitious design to refine architecture and converge quickly on design decisions.<\/li>\n<li>Ensure compliance with OIF Common Electrical Interface (CEI) specs and related standards across lanes and link budgets for modules and interface cards.<\/li>\n<li>Lead HFSS-based simulations, including transmission lines, transitions (vias, connectors), couplers, launch structures, and RF components.<\/li>\n<li>Develop and refine stack-up, routing, impedance targets, and de-embedding approaches for high density boards.<\/li>\n<li>Define measurement plans and tolerance analyses to validate against spec and environmental\/aging conditions.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\"><strong>Modelling, Data &amp; System Integration<\/strong><\/p>\n<p><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>Collate and provide modelling inputs for optical network\/system teams: generate\/curate highquality Sparameter (S4P) files and IBIS\/IBISAMI models with proper documentation, corners, and validation checks.<\/li>\n<li>Promote innovative modelling automation and data-driven workflows that improve accuracy, repeatability, and productivity.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\"><strong>Test Structures &amp; Evaluation<\/strong><\/p>\n<p><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>Design and evaluate test structures to support product decisions and derisk manufacturing.<\/li>\n<li>Create DOE plans, acceptance criteria, and analysis templates to accelerate iteration and convergence.<\/li>\n<li>Apply agile experimentation principles\u2014rapid prototyping, short feedback loops, and adaptive test planning.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\"><strong>Supplier &amp; Partner Engagement<\/strong><\/p>\n<p><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>Lead supplier engagement for PCB materials (e.g., lowloss laminates), fabrication technologies (HDI, backdrilling, via-in-pad), and component selection (connectors, passives, RF components).<\/li>\n<li>Act as the technical interface to 3rdparty development partners on RF requirements, verification methodologies, and deliverables.<\/li>\n<li>Introduce innovative approaches to supplier collaboration, enabling early risk visibility and accelerated co-development.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\"><strong>Team Collaboration &amp; <\/strong><strong>ElectroMechanical<\/strong><strong> Integration<\/strong><\/p>\n<p><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>Collaborate with mechanical, packaging, optics, and firmware teams to cooptimize electromechanical designs (thermal relief, keepouts, connector placement, EMI\/EMC mitigations).<\/li>\n<li>Contribute to DFM\/DFT practices and testability of RF paths. Leadership &amp; Governance<\/li>\n<li>Provide technical mentoring to one to three direct report and broader team members.<\/li>\n<li>Establish engineering standards, checklists, and review gates for RF design and verification.<\/li>\n<li>Report against deliverables and provide mitigation strategies.<\/li>\n<li>Own risk registers, mitigation plans, and clear communication of trade-offs to stakeholders.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\"><strong>Required Qualifications &amp; Experience <\/strong><\/span><\/p>\n<ul class=\"_1615071d bba930b5\">\n<li>10\u201315+ years in RF\/highspeed digital design (SerDes, PAM4\/NRZ, up to 56\u2013224G lanes) with a delivery track record.<\/li>\n<li>Deep expertise in electromagnetic simulation (HFSS) for transmission lines, launch\/transition optimization, and component modelling.<\/li>\n<li>Strong knowledge of OIFCEI electrical specs and compliance methodologies.<\/li>\n<li>Proficiency with Sparameter generation\/processing (S4P), IBIS\/IBISAMI, and model correlation to lab results.<\/li>\n<li>Hands-on experience with VNA, TDR, highbandwidth scopes, and fixture\/deembedding techniques (TRL\/SOLT, time gating).<\/li>\n<li>Experience collaborating with PCB fabricators on materials (e.g., Megtron, Tachyon, I-Speed), stack-ups, via strategies, and manufacturing constraints.<\/li>\n<li>Excellent communication skills for crossfunctional leadership and partner engagement.<\/li>\n<li>Exposure to optical transceiver modules (QSFPDD\/OSFP, Copackaged Optics) and backplane\/interconnect design.<\/li>\n<\/ul>\n<p class=\"ff633f4c e295a86c d395caa1 _2ec1d73a c2ed5909 _81fa11a8 ca66e979 _8f40af10 _28c75f48\"><span class=\"b616d368 _2b37b0a5\" data-testid=\"expandable-text-box\">Accelerating AI in a Low Carbon World \u2013 Oriole Networks is a photonic networking company, developing disruptive technologies for AI\/ML and HPC networking that will revolutionise data centres.<\/span><\/p>\n","protected":false},"author":1,"featured_media":1429,"template":"","meta":{"_promoted":"","_job_location":"Paignton, England, United Kingdom","_application":"https:\/\/careers.oriolenetworks.com\/jobs\/6932416-senior-principal-rf-manager","_company_name":"Oriole","_company_website":"http:\/\/www.oriolenetworks.com","_company_tagline":"","_company_twitter":"","_company_video":"","_filled":0,"_featured":0,"_remote_position":0,"_job_salary":"","_job_salary_currency":"","_job_salary_unit":""},"job-categories":[152],"job-types":[146],"class_list":{"0":"post-1428","1":"job_listing","2":"type-job_listing","3":"status-expired","4":"has-post-thumbnail","5":"hentry","7":"job-type-full-time"},"_links":{"self":[{"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/job-listings\/1428","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/job-listings"}],"about":[{"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/types\/job_listing"}],"author":[{"embeddable":true,"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/users\/1"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/media\/1429"}],"wp:attachment":[{"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/media?parent=1428"}],"wp:term":[{"taxonomy":"job_listing_category","embeddable":true,"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/job-categories?post=1428"},{"taxonomy":"job_listing_type","embeddable":true,"href":"https:\/\/theemcnews.co.uk\/index.php\/wp-json\/wp\/v2\/job-types?post=1428"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}